Non-destructive mapping of grain orientations in 3D by laboratory X-ray microscopy

نویسندگان

  • S. A. McDonald
  • P. Reischig
  • C. Holzner
  • E. M. Lauridsen
  • P. J. Withers
  • A. P. Merkle
  • M. Feser
چکیده

The ability to characterise crystallographic microstructure, non-destructively and in three-dimensions, is a powerful tool for understanding many aspects related to damage and deformation mechanisms in polycrystalline materials. To this end, the technique of X-ray diffraction contrast tomography (DCT) using monochromatic synchrotron and polychromatic laboratory X-ray sources has been shown to be capable of mapping crystal grains and their orientations non-destructively in 3D. Here we describe a novel laboratory-based X-ray DCT modality (LabDCT), enabling the wider accessibility of the DCT technique for routine use and in-depth studies of, for example, temporal changes in crystallographic grain structure non-destructively over time through '4D' in situ time-lapse studies. The capability of the technique is demonstrated by studying a titanium alloy (Ti-β21S) sample. In the current implementation the smallest grains that can be reliably detected are around 40 μm. The individual grain locations and orientations are reconstructed using the LabDCT method and the results are validated against independent measurements from phase contrast tomography and electron backscatter diffraction respectively. Application of the technique promises to provide important insights related to the roles of recrystallization and grain growth on materials properties as well as supporting 3D polycrystalline modelling of materials performance.

برای دانلود رایگان متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Dark field X-ray microscopy for studies of recrystallization

We present the recently developed technique of Dark Field X-Ray Microscopy that utilizes the diffraction of hard X-rays from individual grains or subgrains at the (sub)micrometrescale embedded within mm-sized samples. By magnifying the diffracted signal, 3D mapping of orientations and strains inside the selected grain is performed with an angular resolution of 0.005 and a spatial resolution of ...

متن کامل

ew opportunities for 3D materials science of polycrystalline materials at the icrometre lengthscale by combined use of X-ray diffraction and X-ray imaging

Non-destructive, three-dimensional (3D) characterization of the grain structure in mono-phase polycrystalline materials is an open challenge in material science. Recent advances in synchrotron based X-ray imaging and diffraction techniques offer interesting possibilities for mapping 3D grain shapes and crystallographic orientations for certain categories of polycrystalline materials. Direct vis...

متن کامل

Three-dimensional orientation mapping in the transmission electron microscope.

Over the past decade, efforts have been made to develop nondestructive techniques for three-dimensional (3D) grain-orientation mapping in crystalline materials. 3D x-ray diffraction microscopy and differential-aperture x-ray microscopy can now be used to generate 3D orientation maps with a spatial resolution of 200 nanometers (nm). We describe here a nondestructive technique that enables 3D ori...

متن کامل

Non - Destructive 3 D X - Ray Microscopy to Complement Physical Cross - Section in the Failure Analysis and Package Development Workflows

This tutorial will describe the novel technique of using leading-edge 3D X-Ray Microscopy (XRM) technology to complement physical cross-section in Failure Analysis (FA) and 3DIC package development workflows. Contrary to popular believe that “3D X-Ray” is too slow, we explain how XRM, a new 3D X-Ray variant technique differs from conventional 3D X-Ray Micro Computed Tomography (MicroCT), and ca...

متن کامل

Non-Destructive Laboratory-Based X-Ray Diffraction Mapping of Warpage in Si Die Embedded in IC Packages

Reliability issues as a consequence of thermal/mechanical stresses created during packaging processes have been the main obstacle towards the realisation of high volume 3D Integrated Circuit (IC) integration technology for future microelectronics. However, there is no compelling laboratory-based metrology that can non-destructively measure or image stress/strain or warpage inside packaged chips...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

عنوان ژورنال:

دوره 5  شماره 

صفحات  -

تاریخ انتشار 2015